ARPA-E Archived Funding Opportunities

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  DE-FOA-0002851 Cooling Operations Optimized for Leaps in Energy, Reliability, and Carbon Hyperefficiency for Information Processing Systems (COOLERCHIPS) Funding Opportunity Announcement (FOA) 10/26/2022 09:30 AM ET 1/27/2023 09:30 AM ET

DE-FOA-0002851: Cooling Operations Optimized for Leaps in Energy, Reliability, and Carbon Hyperefficiency for Information Processing Systems (COOLERCHIPS)

Projects funded under the Cooling Operations Optimized for Leaps in Energy, Reliability and Carbon Hyperefficiency for Information Processing Systems (COOLERCHIPS) program will develop novel high performance, high reliability cooling systems for compute electronics. These cooling systems will enable a new class of power-dense computational systems, data centers, and modular EDGE systems that will be cooled using 5% or less of the IT load at any location in the United States at any time of the year.

The COOLERCHIPS program will support the leveraging of recent nascent advances in thermal management, coolant flow technology, materials, manufacturing, design, controls, and reliability engineering. Illustrative example areas of interest include, but are not limited to:

  • New materials, surface treatments, thermal interface solutions, manufacturing methods and conduction methods for improving heat transfer from chipsets;
  • Advances in heat transfer to create and control 3D fluid structures with minimal thermal boundary layers;
  • Innovations in cooling system engineering for reliability that address severity, occurrence and detectability of potential component failures and novel ideas that include system level risk mitigation, health monitoring and controls; and
  • Novel modular data center or EDGE compute system designs that can operate high density compute systems at any time in any US location with highly efficient cooling systems.

The COOLERCHIPS FOA seeks to encourage the formation of multi-disciplinary teams to overcome the technology barriers for the development of high-performance cooling solutions that can simultaneously achieve the required system reliability and cost viability. Proposing teams should incorporate expertise in relevant compute servers, heat transfer, reliability, modeling, data center techno-economics, data center operation, and commercialization.


Documents

  • COOLERCHIPS Full Application FOA Mod 02 (Last Updated: 1/18/2023 09:54 AM ET)

Previous Versions

  • COOLERCHIPS Concept Paper FOA (Last Updated: 9/21/2022 11:34 AM ET)
  • COOLERCHIPS Full Application FOA Mod 01 (Last Updated: 12/23/2022 04:47 PM ET)

Application Forms and Templates

The following forms and templates may be used as part of the application submission. Note that these forms and templates do not necessarily constitute all the documents required for a complete application. Please refer to the 'Application and Submission Information' of the published announcement to learn more about the required application content requirements.

View Application Forms and Templates

Concept Paper

  • COOLERCHIPS Concept Paper Template (Last Updated: 9/21/2022 11:48 AM ET)

Full Application

  • COOLERCHIPS Technical Volume Template (Last Updated: 12/14/2022 02:50 PM ET)
  • SF-424 (Last Updated: 12/14/2022 02:50 PM ET)
  • Budget Justification Workbook / SF-424A (Last Updated: 12/14/2022 02:51 PM ET)
  • Budget Justification Workbook / SF-424A Guidance (Last Updated: 12/14/2022 02:51 PM ET)
  • Summary For Public Release (Template) (Last Updated: 12/14/2022 02:51 PM ET)
  • FA Summary Slide (Template) (Last Updated: 12/14/2022 02:52 PM ET)
  • Business Assurances Disclosures Form (Template) (Last Updated: 12/14/2022 02:52 PM ET)
  • Business Assurances Disclosures Form (Sample) (Last Updated: 12/14/2022 02:53 PM ET)
  • Replies to Reviewer Comments (Template) (Last Updated: 12/14/2022 02:53 PM ET)

Contact Information

  • ExchangeHelp@hq.doe.gov 
    Please contact the email address above for questions regarding ARPA-Eā€™s online application portal, ARPA-E eXCHANGE.
  • ARPA-E-CO@hq.doe.gov 
    Please contact the email address above for questions regarding Funding Opportunity Announcements. ARPA-E will post responses on a weekly basis to any questions that are received. ARPA-E may re-phrase questions or consolidate similar questions for administrative purposes.

Submission Deadlines

  • Concept Paper Submission Deadline: 10/26/2022 9:30 AM ET
  • Full Application Submission Deadline: 1/27/2023 9:30 AM ET
  • View Full Application Reviewer Comments Period: 3/9/2023 5:00 PM ET ā€“ 3/14/2023 5:00 PM ET