Questions Regarding Funding Opportunity Announcements

Please contact the ARPA-E-CO@hq.doe.gov email address for questions regarding Funding Opportunity Announcements. Upon the issuance of a FOA, only the Contracting Officer may communicate with Applicants. ARPA-E personnel and our support contractors are prohibited from communicating (in writing or otherwise) with Applicants regarding the FOA. This “quiet period” remains in effect until ARPA-E’s public announcement of its project selections.

ARPA-E will not pre-assess an Applicant’s proposal. Prospective Applicants must review the technical requirements of the FOA and independently determine whether their proposed concept warrants a submission.

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ARPA-E Archived Funding Opportunities

DE-FOA-0001972: High Intensity Thermal Exchange through Materials, and Manufacturing Processes (HITEMMP) (SBIR/STTR)

The HITEMMP (High Intensity Thermal Exchange through Materials, and Manufacturing Processes) program will develop novel approaches and technologies for design topologies, materials, and manufacturing of high temperature, high pressure, and highly compact heat exchangers. These heat exchangers will enable efficient and power dense power generation cycles for applications in transportation, electricity generation, and industrial sectors. If successful, the materials and manufacturing advances from the HITEMMP program may also yield broader benefits in other operating regimes, and in applications beyond heat exchangers and power cycles.

The HITEMMP program targets heat exchangers to operate in environments where temperatures and pressures are simultaneously in excess of 800°C and 80 bar, with operating lifetimes of tens of thousands of hours. These heat exchangers must offer superior thermal performance and low pumping power requirements, and must also be cost competitive and durable (per metrics prescribed in Section I.D of the FOA). These performance goals are beyond the capability of any existing technologies, but ARPA-E believes that recent advances in materials, topological design methodologies, and manufacturing technologies can be leveraged to realize the desired extreme-environment heat exchanger capability. Specific developments include:

  • The identification and development of materials capable of withstanding extreme temperature and pressure conditions while featuring attractive thermo-mechanical and manufacturability properties;
  • Advances in additive and/or subtractive manufacturing techniques to enable the cost-effective realization of small structural feature sizes, smooth surface finishes, and other enabling heat exchanger characteristics; and
  • The refinement and application of advanced design methodologies to leverage new material capabilities while incorporating manufacturing constraints.

ARPA-E has issued this FOA to encourage the formation of multi-disciplinary teams to work to overcome the materials, design, and manufacturing technology barriers that have thus far prevented the realization of catalyzing the development of the desired extreme environment heat exchanger capability. ARPA-E has identified two categories of recuperator-type heat exchangers (> 800°C and > 1100°C, corresponding to metallic and to ceramic/composite materials sets, respectively) as challenge problems.

Each category has performance metrics, as described in Section I.D of this FOA. Applicants are expected to select one of the two categories. In each category, ARPA-E anticipates that teams will initially execute an analytical/computational design effort, will reduce key risks through small-scale heat exchanger module experiments, and will demonstrate a heat exchanger with the desired performance and durability at 50 kW thermal (kWth) scale.

Documents

  • HITEMMP SBIR/STTR - Full Application FOA - Mod 01 (Last Updated: 10/25/2018 04:27 PM ET)

Previous Versions

  • HITEMMP SBIR/STTR - Concept Paper FOA (Last Updated: 8/9/2018 10:22 AM ET)

Required Application Documents

Pursuant to the FOA, Applicants are required to submit the "Required Application Documents" with their Application. Incomplete applications will not be reviewed or considered.

View Template Application Documents

Concept Paper

  • HITEMMP SBIR - Concept Paper Template (Last Updated: 8/9/2018 10:22 AM ET)

Full Application

  • HITEMMP SBIR/STTR - Technical Volume Template (Last Updated: 10/25/2018 05:37 PM ET)
  • SF-424 (Last Updated: 10/25/2018 05:37 PM ET)
  • HITEMMP SBIR/STTR - Budget Justification/ SF-424A Workbook (Last Updated: 10/25/2018 05:38 PM ET)
  • Budget Justification/ SF-424A Workbook Guidance (Last Updated: 10/25/2018 05:38 PM ET)
  • Business Assurances & Disclosures Form - Template (Last Updated: 10/25/2018 05:38 PM ET)
  • Business Assurances & Disclosures Form - Sample (Last Updated: 10/25/2018 05:39 PM ET)
  • Summary Slide Template (Last Updated: 10/25/2018 05:39 PM ET)
  • Summary for Public Release Template (Last Updated: 10/25/2018 05:41 PM ET)
  • U.S. Manufacturing Plan Template (Last Updated: 10/25/2018 05:48 PM ET)
  • SBIR - VCOC Certification (Last Updated: 10/25/2018 05:41 PM ET)
  • Replies to Reviewer Comments Template (Last Updated: 10/25/2018 05:42 PM ET)

Contact Information

  • ExchangeHelp@hq.doe.gov 
    Please contact the email address above for questions regarding ARPA-E’s online application portal, ARPA-E eXCHANGE.
  • ARPA-E-CO@hq.doe.gov 
    Please contact the email address above for questions regarding Funding Opportunity Announcements. ARPA-E will post responses on a weekly basis to any questions that are received. ARPA-E may re-phrase questions or consolidate similar questions for administrative purposes.

Submission Deadlines

  • Concept Paper Submission Deadline: 9/12/2018 9:30 AM ET
  • Full Application Submission Deadline: 12/11/2018 9:30 AM ET
  • View Full Application Reviewer Comments Period: 1/28/2019 5:00 PM ET – 2/1/2019 5:00 PM ET