| | | | | |
Background, Interest,
and Capabilities | |
| | |
| | | | |
 | Loading… |
|
| Loading… |
| | |
| Loading… |
|
| | SineWatts, Inc. | Shiba Bhowmik | |
Small Business
|
Power Generation: Renewable
| SineWatts has developed a microchip
distributed inverter technology for smart, safe
and intelligent photovoltaic (PV) systems that
allows 3-5x cost reduction of module level
power electronics (MLPE) and complete (100%)
siliconization of the semiconductor components.
Its a single SKU solution for all PV market
segments - residential to commercial to utility
scale – and for all geographic locations. The
technology is applicable for PV-only, battery-
only and PV + battery storage systems utilizing
our proprietary AC-stacking architecture -
Inverter Molecule(TM). Panel level granularity
of diagnostics, prognostics and analytics allow
SineWatts PV power plants to generate
recurring revenue streams. We are a two times
DOE SunShot Incubator awardee to develop the
technology - 2018 products with silicon switches
and future versions employing WBG devices.
SineWatts is presently in technology
demonstration with a major utility and the
industry’s leading R&D partner and headed into
commercialization with two (2) go-to-market
partners - a leading PV panel manufacturer and
their contract manufacturer (CM). |
| |
| | The Ohio State University | Fang Luo | |
Academic
|
Other Energy Technologies
| This team is focusing on high power density/high efficiency motor drive and power supplies for aerospace & aeronautic applications. The team members have comprehensive and complimentary research backgrounds from device modeling, power module packaging, to converter design and system control. |
| |
| | United Silicon Carbide, Inc. | Matt O'Grady | |
Small Business
|
Other Energy Technologies
| United Silicon Carbide, Inc. is a leading provider of SiC diodes and switches. Our standard products include 650V and 1200V SiC diodes and cascodes. SiC cascodes feature Si-Mosfet compatible gate drive, fast switching, excellent reverse conduction, near ideal reverse recovery, and low specific on-resistance. Our R&D capability includes high current SiC die, medium voltage switches, customized modules, and converter design. Areas of interest for teaming include providing support and devices for use of SiC cascodes for power conversion, SiC JFETs for circuit breakers and current limiting, and customized medium voltage switch modules. |
| |
| | U.S. Army Research Laboratory | Dr. Lauren Boteler | |
Government Owned and Operated (GOGO)
|
Transportation
| The U.S. Army Research Laboratory has expertise in both power device characterization and advanced packaging. Our research focuses on the development of holistic, multi-physics approaches to power module development that address the electrical, thermal and thermo-mechanical issues in a coupled manner to realize the full performance of WBG semiconductor devices. We focus on innovative packaging solutions which integrate novel configurations, advanced manufacturing technologies, numerical analyses, novel materials, and innovative design processes. We also investigate integrated heat sinks and transient thermal mitigation to reduce system over-design. We have a full suite of thermal and electrical test beds for high power, pulsed, and high voltage applications. We also have a strong understanding of SiC device reliability physics and WBG circuit design. |
| |
| | Northeastern University | Mahshid Amirabadi | |
Academic
|
Other Energy Technologies
| Research areas:
1. Novel power converter topologies (ac-ac, dc-ac, ac-dc, dc-dc, and hybrid configurations) for significant improvements in efficiency, power density, and lifetime;
2. Novel control techniques for suppressing the double frequency harmonic in single-phase inverters and rectifiers without using large passive components;
3. Reliability algorithms, smart fuse manufacturing, smart MOVs, machine learning for fault diagnosis;
4. High density power converters and integrated magnetics.
Applications:
PV systems, wind power systems, adjustable speed drives, wireless power transfer systems, electric vehicles, battery power management, and LED lighting.
Faculty members:
-Brad Lehman (lehman@ece.neu.edu)
-Mahshid Amirabadi (m.amirabadi@neu.edu)
More information at:
http://www.ece.neu.edu/groups/power/lehman/
http://www.northeastern.edu/amirabadi/ |
| |
| | Virginia Polytechnic Institute and State University | Rolando Burgos | |
Academic
|
Other Energy Technologies
| The Center for Power Electronics Systems (CPES), with annual research expenditures of $4-5 million dollars, is dedicated to improving electrical power processing and distribution that impact systems of all sizes – from battery-operated electronics to vehicles to regional and national electrical distribution systems.CPES has a worldwide reputation for its research advances, its work with industry to improve the entire field, and its many talented graduates. From 1998-2008, CPES was a National Science Foundation Engineering Research Center (NSF ERC). A collaboration of five universities and many industrial firms, the CPES ERC was the largest-ever collaboration of power electronics researchers. During the ERC period, CPES developed the IPEM (Integrated Power Electronics Modules), a standardized off-the-shelf module that has revolutionized power electronics.Today, CPES is building on that foundation so that power electronics can fulfill its promise and reduce energy use while helping electronics-based systems grow in capability.
CPES expertise encompasses five technology areas: (1) power conversion technologies and architectures; (2) power electronics components; (3) modeling and control; (4) EMI and power quality; and (5) high density integration.The Center’s targeted applications include: (1) Power management for information and communications technology; (2) Point-of-load conversion for power supplies; (3) Vehicular power conversion systems; (4) high power energy systems.
The CPES industry consortium comprises over 70 members engaged with the Center to stay abreast of technological developments in power electronics.
CPES research facilities encompass more than 19,000 sqft including the electrical power and the packaging and integration research and development laboratories.
CPES is formed by 6 faculty members:
- Fred Lee
- Dushan Boroyevich
- Khai Ngo
- Rolando Burgos
- Qian Li
- G.Q. Lu (associate faculty) |
| |
| | Precision Optical Transceivers | Thomas Benedett | |
Small Business
|
Other Energy Technologies
| Precision Optical Transceiver’s is a systems solution company focusing on the introduction of high rate optical transceivers and associated technologies into the Datacom/Telecom market. We service our customers by suppling COTs transceivers configured and tested to operate in specific network topologies. We develop custom software, hardware, and embedded solutions to meet our clients rapidly changing market needs. We have a multifaceted sales, marketing, engineering, and manufacturing staff to design and deliver our product line. Typical products include SFP, SFP+, XFP, CFP, QSFP, and QSFP-28 transceivers. Precision is known very well within in the transceiver industry and we provide the best software distributions that directly and intuitively satisfy our customer needs.
In addition to our highly successful core transceiver business, Precision R&D focuses on silicon photonics, signal processing, RF, and software defined networking. Our engineering staff consists of a highly diverse team of software and hardware engineers most of which who come from a background in military software defined radios. We have skillsets ranging from silicon photonic device design, modem/physical layer digital signal processing, RF and optical transceiver design, large scale embedded software architectures, design for secure communications, and both radio and fiber communications theory. As members of AIM photonics, Precision R&D is developing cutting edge silicon photonic transceivers and optical filtering networks for on chip-optical signal processing.
Precision is seeking projects that align well with our growing staff skill sets and technology interests. We are specifically looking to tackle difficult problems that improve our teams existing knowledge base in silicon photonics, all optical signal processing, digital signal processing, high rate optical data communications, RF over fiber, and software defined networking. We would additionally be interested in seeking projects related to silicon photonic packaging related issues such as fiber connect; both active and passive alignment problems. |
| |
| | AgileSwitch, LLC | Albert Charpentier | |
Small Business
|
Power Generation: Renewable
| AgileSwitch is a global leader in Gate Drivers for WBG Power Modules, particularly Silicon Carbide. Our patented switching techniques have demonstrated improved switching performance and efficiency in power converters and inverters alike.
Through the CIRCUITS program AgileSwitch intends to miniaturize its patented technologies, with the end goal of having a family of Gate Driver Integrated Circuits that can be applied to a wide variety of applications in Solar, Wind, EV, Storage, Smart Grid, etc.
The Gate Driver IC would dramatically improve the cost/ benefit ratio for engineers considering the use of WBG Power Devices in their products, and significantly accelerate the adoption of WBG Power Modules. |
| |
| | Kilpatrick Townsend & Stockton LLP | Craig Largent | |
Large Business
|
Other Energy Technologies
| We are an international law firm with a strong Intellectual Property practice. Our Electrical Engineering & Software team includes patent attorneys with doctorates in semiconductor devices and we have extensive experience obtaining patents covering wide-bandgap electronic devices and circuits. |
| |
| | University of Wisconsin -Madison | Daniel Ludois | |
Academic
|
Other Energy Technologies
| My work focuses on evolving power conversion by utilizing emerging materials and manufacturing techniques, especially in electric machines and drives. My efforts can be separated into three thrusts.
1. Electrostatic Machinery - Electric machines may be constructed using non-magnetic materials by utilizing electrostatic forces, rather than magnetic. This allows machines to be 3D printed or injection molded from plastic or cast in aluminum, thereby eliminating steel, copper windings, and permanent magnets of conventional machines. Fractional horsepower 3D printed prototypes have demonstrated torque densities comparable to their magnetic counterparts. These electrostatic machines require compact high voltage power electronics (5 – 10kV) to serve as the drive, which SiC devices are ideally suited for.
2. Wireless power transfer – Multi MHz Class E resonant converters formed with GaN enable capacitively coupled transmitter and receiver structures which are simple to construct and are highly efficient.
3. Duel Energy Cores – This work integrates inductors and capacitors into a common structure, but their operation is decoupled as though they were discrete lumped elements. The single structure is referred to as a dual energy core. The approach lowers the passive footprint and combines two parts into a single manufacturing step. This is done by making the conducting plates of a rolled film capacitor from a permeable material, e.g. steel or nickel, to serve as a tape wound toroidal core that is wrapped with an auxiliary winding to form an inductor. Alternatively, this may be thought of as using the core laminations of an inductor as the parallel plates of a capacitor. This technique may be done through vapor deposition of materials, discrete foils/films, or 3D printing.
Daniel Ludois received his Ph.D. in electrical engineering from the University of Wisconsin–Madison in 2012 and B.S. in Physics from Bradley University in 2006. Dr. Ludois currently serves as assistant professor of electrical and computer engineering in UW–Madison’s College of Engineering, associate director of the internationally renowned Wisconsin Electric Machines and Power Electronics Consortium (WEMPEC), and is an affiliate of the Wisconsin Energy Institute. Dr. Ludois’s efforts in electrostatic machinery earned him a 2015 National Science Foundation CAREER Award and in 2016 he was added to Midwest Energy News’ 40 under 40 list. He has published ~35 papers and filed 11 patents |
| |
| | Iris Technology Corporation | Karen Longoria | |
Small Business
|
Other Energy Technologies
| Iris Technology has developed mission-critical components and solutions with strategic aerospace and defense industry partners since 1986. We have developed small and large power solutions for both tactical defense related solutions as well as power generation solutions for aerospace needs. Our hybrid power solutions include products fully interoperable with generators, solar panels, fuel cells and alternate power sources utilizing high efficiency wide-bandgap (WBG) semiconductor devices. Additionally, we provide sophisticated control electronics, power and data processing for cryogenics, imaging, and radiation hard electronics needs for multiple aerospace customers. Our solutions are innovative and sophisticated with high efficiency, ultimately providing large percentage cost savings to our end users. |
| |
| | Sandia National Laboratories | Alyssa Kolski | |
Federally Funded Research and Development Center (FFRDC)
|
Other Energy Technologies
| Sandia National Laboratories is a multi-program laboratory which focuses on research with high impact to the nation’s interests. Sandia has numerous sustained research thrusts in next-generation wide bandgap (WBG) semiconductors as well as beyond next-generation ultra-wide bandgap (UWBG) materials and devices. These research thrusts span the continuum of TRL levels, from basic materials science and device fabrication to performance analysis and optimization of applicable end-use systems.
Sandia has long-term expertise in all hierarchies of WBG semiconductor usage and is currently conducting research in areas including:
Devices: Crystal growth and fabrication of high-voltage (~kV) GaN and nitride-based UWBG devices, investigating defect physics and mitigating their impacts on device performance, and studying long-term reliability of devices under high stress (electrical, thermal, radiation) environments
Modules: Constructing high-voltage, high performance, low cost power modules using additive manufacturing techniques
Circuits: Utilizing GaN, SiC, and UWBG devices in a wide variety of power electronics circuits to expand the limits of size, weight, and power gains from WBG and UWBG implementation
Systems: Enabling new functionalities, reduced system costs, and increased system reliability of end-use systems through WBG implementation, complex systems analysis and optimization, advanced controls, and novel system topologies. |
| |
| | North Dakota State University | Dong Cao | |
Academic
|
Transportation
| NDSU Team has the capability of High Power, High frequency, and high density power conversion systems using SiC and GaN devices, espectially on
1. Multilevel dc-dc/dc-ac converter topologies
2. New resonant switched-capacitor converter topologies
3. Smart gate drive for next generation high power devices
4. Reliability and health monitoring of high power inverters
5. High density power conversion for data-centers
The sponsors for NDSU-SPEED lab includes, NASA, Google, John Deere, Ford, Transphorm, Maxir Investment, Rohm, etc. |
| |
| | FastCAP Systems Corp. | Dr. John Cooley | |
Small Business
|
Other Energy Technologies
| HIGH FREQUENCY HIGH POWER ENERGY STORAGE
FastCAP is an internationally recognized leader in the development and commercialization of cutting-edge rugged Extreme Environment (EE) ultracapacitors – lithium free, high powered, and rechargeable devices which operate at extreme high temperature, shock and vibration conditions in the aerospace, defense, and oil & gas industries. FastCAP achieved six world records in ultracapacitor technology including the one presented herein.
FastCAP’s AC ultracapacitors are first of their kind ultracapacitors with natural frequencies greater than 500 Hz. An engineered internal architecture based on advanced carbon-based nanomaterials presents a very low internal cell resistance (< 2 mOhms). This high frequency high power ultracapacitor shows a very thin profile (< 2.5 mm), keeping an overall low volume (< 3 mL). Custom form factors can be produced for a specific available space on a circuit board. The ultracapacitor capacitance may vary from a few millifarad to several Farads depending on the system requirements. FastCAP is able to leverage the knowledge developed in our high temperature ultracapacitor and translate to this device similar characteristics. We anticipate that FastCAP’s AC ultracapacitor can achieve high operating temperature (v1: 85°C, v2: 105°C). Current AC ultracapacitor design stands at technology readiness level 4 (TRL4).
We believe that the product could be used to increase the power density of power systems in both double-line frequency rectifier filtering and also reactive power compensation applications. |
| |
| | Stanford University | Prof. Juan Manuel Rivas Davila | |
Academic
|
Other Energy Technologies
| My research is looking at the limitations behind today’s converters and providing solutions that include new circuit topologies that use WBG devices as well as exploring new fabrication techniques to improve passive components and enhance their thermal performance. We study topologies that rely on resonant circuits that minimize switching losses in the semiconductors. Conventional designs suffer from switching losses that can only be partially mitigated by modern WBG devices. But most implementations using WBG switches, operate in the same switching frequencies range achieved by Silicon semiconductors. Energy storage devices are intrinsic to any power electronic design and often determine the overall size and weight of the system. Moreover, the amount of energy storage needed in a circuit are reduced as the switching frequency increases. Reasons behind the disappointing sub-utilization of the switching capabilities of WBG devices are package parasitics, EMI concerns, poor layout and most importantly core losses in magnetic components. In my research group we are exploring ways to increase the switching frequency of power converters to levels that are higher than conventional designs by an order of magnitude or more. High frequencies allows magnetic components to be implemented without magnetic cores. Doing so can reduce the weight and size of the magnetic elements and increase their efficiency as the quality factor improves with frequency, and the core losses are eliminated. Moreover, some of the magnetic elements can be incorporated as part of the printed circuit board layout, to reduce component variability and reduce tuning effort. Additional advantages of this approach include fast transient response (e.g. reaching steady state in sub-microsecond times), as well as the elimination of large energy storage components typically found in traditional converter topologies. Moreover, air core inductors are not limited by core material properties like saturation or curie temperatures, vastly expanding their application range. We are using PCB and 3D printed inductors to improve power densities in converter working at freq. .>10MHz and power reaching several kW. My group is using capacitive isolation, which becomes an attractive option at 10’s oflMHz, to enable high gain conversion ratio while maintaining good efficiency. We have achieved large voltage gains (>30) and transient response that response that can supply 2kW and reach 8kV in about 1μs. |
| |
| | Northeastern University | Aatmesh Shrivasstava | |
Academic
|
Other Energy Technologies
| Power Management Circuits,
Architecture for integrated boost converter for solar energy harvesting from low to medium power levels,
Single Inductor multiple-output DC-DC converter,
Analog and Mixed Signal circuit design |
| |
| | Infineon Technologies Americas Corp. | Tim MacDonald | |
Large Business
|
Other Energy Technologies
| Infineon Technologies Americas Corporation is a global leader in providing power conversion solutions. This includes development of Gallium Nitride based devices and systems. The anticipated CIRCUITS FOA creates opportunities for Infineon to partner with labs, research institutions and supply chain partners to develop creative, high performance GaN based power systems. |
| |
| | NC State University - FREEDM Syst Ctr & PREES Lab | Douglas C Hopkins | |
Academic
|
Grid
| Partnerships are sought by Dr Hopkins, who is part of the Future Renewable Electric Energy Delivery and Management (FREEDM) Systems Center and directs the Power Electronics Design & Packaging Laboratory (PREES). Dr Hopkins’ expertise is in high density/high frequency power electronics design and spans pulse power (e.g. 30MW/10kHz with vacuum-arc switched conversion) to power supply (e.g. 100W/2-10MHz with resonant conversion.
FREEDM & PREES provide complete power electronics design and testing capabilities for kW-to-MW systems. In particular, PREES Lab (www.prees.org) is a full power electronics packaging laboratory developing advanced WBG intelligent power modules, power device test platforms and dense power circuits. The Lab makes extensive use of MultiPhysics modeling for complete electro-physical design. Typical procedure is: electrical simulation with Spice/PLECS/Matlab; design of physical module/system; ANSYS-Q3D analysis of electrical parasitics; refinement of electrical and physical circuits; thermal/mechanical simulation with COMSOL; and final refinement before build.
[Recent and existing projects (2016) include a 6.5kV/250A supercascode SiC power module, 1kV-100kV 1MHz gate drive with power over fiber, 10kV/250A Full Power Test Platform using recirculating energy conversion for high speed WBG power module testing, 1.2kV/50A True-3D cubic 1/2-bridge power module (a new concept demonstration in power packaging, 12V:1V/100W GaN VRM using Folded Flex construction, and a 30kW EV inverter with fluid cooling of devices and inductors.]
Ex. PUBLICATIONS
1. "Design Methodology for a Planarized High Power Density EV/HEV Traction Drive using SiC Power Modules", Dhrubo Rahman, et.al., IEEE Energy Conversion Congress & Exposition (ECCE 2016), Milwaukee, WI, Sept 18-22, 2016
2. "Decomposition and Electro-Physical Model Creation of the CREE 1200V, 50A 3-Ph SiC Module," A. Morgan, et.al., IEEE Applied Power Electronics Conference and Exposition (IEEE-APEC), Long Beach, CA, 2016 (Best Paper of Session)
3. “A Robust, Composite Packaging Approach for a High Voltage 6.5kV IGBT and Series Diode,” A. J. Morgan, et.al., 48th IMAPS Int’l Symp. on Microelectronics, Orland, FL Oct 28-30, 2015
4. “Results for an Al/AlN Composite 350˚C SiC Solid-State Circuit Beaker Module,” K. Bhat, et.al., IEEE Applied Power Elect. Conf., Orlando, FL, Feb 5-9, 2012. |
| |
| | University of Toledo | Raghav Khanna | |
Academic
|
Other Energy Technologies
| * Physics-based wide bandgap semiconductor device modeling
* Behavioral modeling of wide bandgap semiconductors
* Gate drive in next generation power electronics
* Reliability and sustainability of next generation power electronics
* Renewable energy integration
* Optimization of parasitic elements in next generation power electronics for improved performance of wide bandgap semiconductors |
| |
| | ThermAvant Technologies, LLC | ThermAvant, attn J Boswell | |
Small Business
|
Other Energy Technologies
| ThermAvant is the leading developer of thermal management and heat transfer solutions based on the "oscillating heat pipe" or OHP technology. We design, simulate, build and test custom thermal solutions for government and private party customers seeking improved size, weight, power and cost trade-offs in their thermal management and heat transfer applications. We specialize in high heat flux heat spreaders with internal OHPs for cooling of microchips, optical elements and a variety of temperature sensitive devices; and also in heat sinks that utilize the OHP's lightweight, conformable form factors to transfer heat loads over long distances with low thermal resistances for power and energy applications. |
| |
| | The University of Alabama | Andy Lemmon | |
Academic
|
Other Energy Technologies
| The growing power electronics research program at the University of Alabama has several specialties that are considered relevant to the CIRCUITS FOA. For example, we have competency in the following areas:
* Modeling of WBG devices through behavioral and physics-based approaches
* Measurement-based modeling of semiconductor packaging and parasitics within other converter-relevant structures
* Finite element analysis (FEA) of semiconductor packaging and parasitics within other converter-relevant structures
* Development of high-performance gate-drive circuits for SiC devices, with robust CM immunity
* Optimization of switching characteristics for SiC MOSFET's and SiC JFET's
* Optimization of hard- and soft-switched converters for power density and efficiency
* Management of the side-effects of fast switching including half-bridge shoot-through, oscillation, etc.
* EMI Characterization and mitigation |
Website: http://ece.eng.ua.edu/
Email: lemmon@eng.ua.edu
Phone: 205-348-2747
Address: The University of Alabama, Electrical & Computer Engineering, 245 7th Ave., 342 HM Comer Bldg. Tuscaloosa, AL 35487
| |
| | University of Idaho | Vishal Saxena | |
Academic
|
Other Energy Technologies
| Dr. Vishal Saxena is Micron Endowed Professor, and Associate Professor in the Department of Electrical and Computer Engineering at the University of Idaho. His research is in the area of Analog, Mixed-signal, Power Management, and Photonic integrated circuit (IC) and system design. His interests include leveraging wide bandgap devices to develop novel circuit topologies for power management, portable energy conversion, RF and millimeter-wave power amplifiers, and energy efficient data centers. |
| |
| | PARC | David Schwartz | |
Small Business
|
Other Energy Technologies
| PARC has several technologies applicable to the CIRUICTS FOA. These include novel high-efficiency, high-frequency power converter topologies, high-Q on-chip inductors, and high-efficiency thermal management solutions. PARC is seeking partners with capability in wide-bandgap devices, circuits, and/or packaging. |
| |
| | Akoustis Technologies, Inc. | Shawn Gibb | |
Small Business
|
Other Energy Technologies
| Akoustis is a high-tech RF filter solutions company that manufactures our unique, patent-pending BulkONE™ technology to produce single crystal bulk acoustic wave (BAW) RF filters for the mobile-wireless industry, which facilitate signal acquisition and improve radio performance between the antenna and the baseband of mobile devices. Our BulkONE™ technology will service the fast growing multi-billion dollar market of device OEMs, network providers, and consumers to diminish front end phone heat, battery drain and signal loss -- all considered to be directly related to current RF polycrystalline filter technologies’ limitations. Akoustis’ capital-efficient business model leverages third party investments and existing manufacturing infrastructure in the semiconductor industry.
Our capabilities include: single crystal materials growth and characterization, wafer fabrication, resonator and filter test and modeling, product design testing of novel single crystal based BAW RF filter technologies for frequencies up to 20 GHz. |
| |
| | ANSYS, Inc. | Geoff Hoekstra | |
Large Business
|
Other Energy Technologies
| ANSYS is the leading engineering simulation software company. Our solutions cover electromagnetic, thermal, structural, computational fluid dynamics (CFD), Model Based System Engineering (MBSE) and IC chip design.
ANSYS electronics solutions help you design innovative electrical and electronic products faster and more cost-effectively than ever before. This includes EMI/EMC analysis. Our industry leading electromagnetic field, circuit, systems and multiphysics simulation software fully automates the design process so you can better understand how your products behave. You can quickly optimize your design using simulation instead of wasting time building and testing costly prototypes. So whether it's a computer chip, a circuit board, a cell phone, an electronic component in an automobile or an entire communications system, ANSYS software can help you design better products.
The ANSYS structural analysis software suite enables you to solve complex structural engineering problems and make better, faster design decisions. With finite element analysis (FEA) tools, you can customize and automate your simulations, and parameterize them to analyze multiple design scenarios. ANSYS Structural Mechanics software easily connects to other physics analysis tools, providing even greater realism in predicting the behavior and performance of complex products.
ANSYS CFD solutions give you the power to model and simulate all fluid processes — including fluid–structure multiphysics interactions — so you can have confidence that your product will perform optimally before you make the first prototype.
Embedded software is increasingly being used in smart devices, but imperfect code can be the cause of product failures. Some industry leaders claim every 1,000 lines of embedded software contain eight bugs. To manage this quality risk and comply with standards, companies need to leverage software simulation tools and certified code generators. ANSYS provides a model-based embedded software development and simulation environment with a built-in automatic code generator.
The complexity within systems arises from the challenges of connecting the individual pieces to ensure they work together as designed and expected. By developing virtual product prototypes with ANSYS system simulation tools, companies are coupling the physical attributes of a product with the systems and embedded software, assuring that the individual pieces that comprise the product work in unison as planned. |
| |