ARPA-E Archived Funding Opportunities


Development of advanced power electronics with unprecedented functionality, efficiency, reliability, and form factor will help provide the U.S. a critical technological advantage in an increasingly electrified world economy. The CIRCUITS (Creating Innovative and Reliable Circuits Using Inventive Topologies and Semiconductors) program seeks to accelerate the development and deployment of a new class of efficient, lightweight, and reliable power converters based on wide bandgap (WBG) semiconductors through transformational system-level advances that enable effective operation at high switching frequency, high temperature, and low loss. Previous efforts by ARPA-E and others have primarily focused on WBG material and device development without focused consideration and redesign of the circuit topology. Such solutions do not fully exploit the potential performance improvements enabled by this new class of power semiconductor devices. Areas of particular interest for the CIRCUITS program include novel circuit topologies, advanced control and drive electronics, and innovative packaging. Such technological breakthroughs would catalyze the adoption of higher performance power converters in various critical applications (motor drives, automotive, power supplies, data centers, aerospace, ship propulsion, rail, distributed energy, and the grid) that offer significant direct and indirect energy savings and emissions reductions across electricity generation, transmission and distribution, and load-side consumption. Coupling novel and advanced circuit topologies with leading edge materials such as WBG semiconductor devices has the capacity to catalyze disruptive improvements for power electronics and subsequently for the U.S. economy.


  • CIRCUITS FOA - Full Application (Last Updated: 6/12/2017 02:53 PM ET)

Previous Versions

  • CIRCUITS FOA - Concept Paper (Last Updated: 1/9/2017 11:54 AM ET)
  • CIRCUITS - Concept Paper - Mod 01 (Last Updated: 1/10/2017 04:46 PM ET)
  • CIRCUITS FOA - Full Application (Last Updated: 4/3/2017 12:33 PM ET)

Application Forms and Templates

The following forms and templates may be used as part of the application submission. Note that these forms and templates do not necessarily constitute all the documents required for a complete application. Please refer to the 'Application and Submission Information' of the published announcement to learn more about the required application content requirements.

View Application Forms and Templates

Concept Paper

  • CIRCUITS FOA - Concept Paper Template (Last Updated: 1/9/2017 12:01 PM ET)

Full Application

  • CIRCUITS - Technical Volume Template (Last Updated: 4/3/2017 12:45 PM ET)
  • SF-424 (Last Updated: 4/3/2017 12:46 PM ET)
  • Budget Justification/ SF-424A Workbook (Last Updated: 4/3/2017 12:47 PM ET)
  • Budget Justification/ SF-424A Workbook Guidance (Last Updated: 4/3/2017 12:48 PM ET)
  • Business Assurances & Disclosures Form - Template (Last Updated: 4/3/2017 12:48 PM ET)
  • Business Assurances & Disclosures Form - Sample (Last Updated: 4/3/2017 12:49 PM ET)
  • Summary Slide Template (Last Updated: 4/3/2017 12:50 PM ET)
  • Summary for Public Release Template (Last Updated: 4/3/2017 12:50 PM ET)
  • Replies to Reviewer Comments Template (Last Updated: 4/3/2017 12:50 PM ET)

Contact Information

    Please contact the email address above for questions regarding ARPA-E’s online application portal, ARPA-E eXCHANGE.
    Please contact the email address above for questions regarding Funding Opportunity Announcements. ARPA-E will post responses on a weekly basis to any questions that are received. ARPA-E may re-phrase questions or consolidate similar questions for administrative purposes.

Submission Deadlines

  • Concept Paper Submission Deadline: 2/21/2017 5:00 PM ET
  • Full Application Submission Deadline: 5/1/2017 5:00 PM ET
  • View Full Application Reviewer Comments Period: 7/14/2017 5:00 PM ET – 7/19/2017 5:00 PM ET