Questions Regarding Funding Opportunity Announcements

Please contact the ARPA-E-CO@hq.doe.gov email address for questions regarding Funding Opportunity Announcements. Upon the issuance of a FOA, only the Contracting Officer may communicate with Applicants. ARPA-E personnel and our support contractors are prohibited from communicating (in writing or otherwise) with Applicants regarding the FOA. This “quiet period” remains in effect until ARPA-E’s public announcement of its project selections.

ARPA-E will not pre-assess an Applicant’s proposal. Prospective Applicants must review the technical requirements of the FOA and independently determine whether their proposed concept warrants a submission.

.

ARPA-E Archived Funding Opportunities

DE-FOA-0000938: RFI on Personal Thermal Management Systems to Reduce Building Energy Consumption

ARPA-E seeks input from researchers and technologists from a broad range of fields and disciplines to address advanced clothing and textiles with enhanced thermal management capabilities.  These technical solutions have the potential to enable a wider temperature set point range for buildings, thereby reducing the energy consumed to heat or cool them, while maintaining or improving personal thermal comfort for building occupants. The information you provide may be used by ARPA-E in support of program planning.


THIS IS A REQUEST FOR INFORMATION ONLY.  THIS NOTICE DOES NOT CONSTITUTE A FUNDING OPPORTUNITY ANNOUNCEMENT (FOA). NO FOA EXISTS AT THIS TIME.


Documents

  • RFI_Personal Thermal Management Systems_updated_07.10.2013 (Last Updated: 6/6/2013 11:23 AM ET)

Contact Information

  • ARPA-E-RFI-Textiles@hq.doe.gov 
    Responses to this RFI must be submitted in Microsoft Word (.doc or .docx) or Adobe Acrobat (.pdf) format and attached to an email addressed to ARPA-E-RFI-Textiles@hq.doe.gov and RECEIVED BY NO LATER THAN 8:00 PM EDT ON July 26, 2013. Responses submitted by other means will not be reviewed or considered. Questions regarding the content of this RFI must be submitted to the email address provided above.

Submission Deadlines

  • Concept Paper Submission Deadline: TBD
  • Full Application Submission Deadline: TBD