Questions Regarding Funding Opportunity Announcements

Please contact the ARPA-E-CO@hq.doe.gov email address for questions regarding Funding Opportunity Announcements. Upon the issuance of a FOA, only the Contracting Officer may communicate with Applicants. ARPA-E personnel and our support contractors are prohibited from communicating (in writing or otherwise) with Applicants regarding the FOA. This “quiet period” remains in effect until ARPA-E’s public announcement of its project selections.

ARPA-E will not pre-assess an Applicant’s proposal. Prospective Applicants must review the technical requirements of the FOA and independently determine whether their proposed concept warrants a submission.

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ARPA-E Archived Funding Opportunities

DE-FOA-0002499: Request for Information (RFI) DE-FOA-0002499 on Nonconventional Fusion Approaches and Energy Applications

The purpose of this RFI is to solicit input for a potential future ARPA-E research program on nonconventional fusion approaches. This is a new “hybrid” RFI format where traditional written responses are accepted as before, but with the new option of participating in a Polyplexus incubator online discussion and Ask-Me-Anything (AMA) session. Further instructions and details are provided in the RFI.

Responses to this RFI should be submitted in PDF format to the email address ARPA-E-RFI@hq.doe.gov by 5:00 PM Eastern Time on 4/30/2021 and/or via participation in the Polyplexus incubator (March 17 to April 7, 2021) and/or AMA (March 26, 2021, 1:00 to 3:00 PM Eastern Time). Participation via Polyplexus is strongly encouraged.

THIS IS A REQUEST FOR INFORMATION ONLY. THIS NOTICE DOES NOT CONSTITUTE A FUNDING OPPORTUNITY ANNOUNCEMENT (FOA). NO FOA EXISTS AT THIS TIME.

Respondents shall not include any information in the response to this RFI that could be considered proprietary or confidential.

Documents

  • RFI DE-FOA-0002490_Nonconventional Fusion Approaches and Energy Applications (Last Updated: 3/17/2021 09:04 AM ET)

Submission Deadlines

  • Concept Paper Submission Deadline: TBD
  • Full Application Submission Deadline: TBD